Electronics Systems Packaging
The Electronics Systems Packaging Group has the unique feature of having modeled a structured academic course in electronics packaging in tune with the universities abroad that are pioneers in this growing field. CEDT is the only institution in India where considerable hands-on experience is given to post-graduate students in electronics packaging, which includes CAD, manufacturing, assembly, electrical test and thermo-mechanical reliability.
This laboratory also includes a state-of-the-art high volume surface mount assembly line capable of flip chip assembly, as well as other equipment for advanced electronics packaging.The surface mount assembly line can be used for prototype creation, fabrication of test structures, development of manufacturing processes or new product launch platform. In addition, in-line inspection capabilities enable x-ray, acoustic and laser profilometry based inspections.
PEOPLE: G.V Mahesh , C Anthonisamy , K.B Vasantha
